20230616 SPE Japan Section conference, “Functional materials for the future of electronics”

June 16, 2023  SPE Japan Section conference, “Functional materials for the future of electronics”

In modern society, high-speed and large-capacity communication technology, computer technology represented by artificial intelligence (AI), and high-definition technology such as 4K and 8K have become indispensable technologies in the electronics field. The semiconductors used in these devices are also required to be compact and have high performance. It is expected that this trend will not stop and will continue to progress in the future. This time, we will ask four lecturers who are active on the front lines to give lectures on the current state of development and future initiatives regarding functional materials used in the electronics field.

It will be held both at the Tokyo venue and online (Zoom). Depending on the situation, it may be held at the venue or online only. Please note that we may not be able to meet your request. Also, we are planning to hold a social gathering for the first time in a long time. Please join us.

Hosted by: SPE Japan Section

Time and date: Friday, June 16, 2023 13:00-17:20

Hybrid event at onsite and virtual via Zoom 

Disclaimers: Only Zoom conference might be held in the case of the Corona virus infection in Tokyo. The host cannot return you a participation fee, even though the Zoom connection is interrupted or is not sufficient to clearly understand presentations.

Place: Sumitomo Bakelite Co., Ltd. 20th floor. Tennoz Parkside Building

5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku, Tokyo 140-0002

TEL: +81-3-5462-4001


The Zoom invitation will be emailed participants by the person in charge.

13:00-13:05 Opening Address


「Wood Nanocellulose-Derived Semiconducting Nanomaterial: 3D Structural Design, Electrical Property Tuning, and Applications」

Dr. Hirotaka Koga, Associate Professor, Institute of Scientific and Industrial Research, Osaka University

(Abstract) Semiconducting materials with tunable electrical properties have played key roles in present electronics. The demand of semiconducting materials has been increasingly growing, and their stable supply has been becoming an issue.

Wood nanocellulose has recently attracted much attention owing to its sustainability, availability, and many unique properties. Here we introduce wood nanocellulose-derived semiconducting nanomaterials, and their 3D structural designability, electrical property tunability, and applications in sensing and energy-generation devices.


「Properties of Cyclo-Olefin Polymers and Their Applications in Electronics」

Mr. Akira Furuko, Team Leader, High Performance Plastics Research Laboratory, Zeon Corporation

(Abstract) In this presentation, the polymer design and properties of cyclo-olefin polymers (COPs) will be introduced. The presentation also reports on the development of COPs with higher heat resistance and their application in electronics.

15:05-15:15 Break


「Fluorine materials and next generation communications efforts」

Mr. Masami Kato, Counselor, Chemical Division, Daikin Industries, Ltd.

(Abstract) In developing 5G/6G technology that allows high speed and large data communication low-loss materials attract increasing attention. Explain the future possibilities and challenges of fluorine materials which Have low dielectric constant and low dielectric loss tangent.


「Material development status related to 5G and 6G communication and the dielectric measurement methods」

Dr. Hajime Serizawa, Advisor, Kawasaki Techno-Research Co., Ltd.

(Abstract) The development status of communication-related materials used for 5G and 6G communication is introduced. Furthermore, the high frequency dielectric measurements used for the communication-related materials are reported.

17:15-17:20 In Conclusion

17:30- Social gathering

Participation Instructions

・Application deadline: Friday, June 9th

・Participation Fee: SPE Japan Section Member: Free 

There are no charges for up to five participants of corporate member, and those with more than five participants are charged.

Non-Members on-site: 15,000 Yen (including taxes)

・Payment deadline for Zoom participants: Monday, June 12th

I will email the designated account separately. If the transfer from the company does not arrive in time, please ask for advance payment.

・Participation fee payment for local participants: Payment will be made on the day of the event, so please prepare cash.

・Banquet fee: Applicants will be charged 5,000 Yen (including taxes) for both members and non-members at the venue on the day.

You can apply from the following:


Log in to HP is necessary to apply for lecture participation from above. Please register with HP prior to login. PWs should be entered and prepared so that you can log in to the member when the user name and e-mail address are sent from server. We recommend that the Mail Member (a free member who has received a membership notification by e-mails) be registered. Registration is free. If you are unable to access them, please send them by e-mails. 

Please contact the following with your name, company name, department, telephone, and email address and attendance at the social gathering to Kimitoshi Sato, in charge of planning, SPE Japan Section.

e-mail: satoh@spejapan.jp

Author: spejapan